Vertical Conveying Continuous Plating Device 'U-VCPS'
A vertical continuous plating device with a simple structure and easy maintenance.
The "U-VCPS" is a fully automatic vertical transport continuous plating device without an upper and lower mechanism, designed for PKG/HDI substrates. It features a simple mechanism with only an upper clamp, capable of handling thin substrates of less than 50μm. The device has a sealed structure, is environmentally friendly, and its simple design makes maintenance easy. We also offer the "U-VCP," a vertical transport continuous electroplating device with a simple structure that minimizes the occurrence of failures. 【Features】 ■ Designed for PKG/HDI substrates ■ Simple mechanism with only an upper clamp ■ Capable of handling thin substrates of less than 50μm ■ Simple structure for easy maintenance ■ Efficient material transfer achieved through a unique circulation method *For more details, please refer to the PDF document or feel free to contact us.
- Company：上村工業
- Price：Other
